Hong Kong, China

Wenjia Zhou

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Fanling, CN (2016)
  • Hong Kong, CN (2015 - 2018)

Company Filing History:


Years Active: 2015-2018

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4 patents (USPTO):Explore Patents

Title: The Innovations of Wenjia Zhou

Introduction

Wenjia Zhou is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic materials, holding a total of 4 patents. His work primarily focuses on catalysts and methods for electroless plating, which are essential in various electronic applications.

Latest Patents

Wenjia Zhou's latest patents include innovative solutions that incorporate precious metal nanoparticles and polymers. One of his patents describes a plating catalyst and method that utilizes a solution containing a precious metal nanoparticle and a polymer polymerized from at least two monomers. These monomers include one with two or more carboxyl groups or carboxylic acid salt groups, and another with π electron-available features. This solution is particularly useful for catalyzing the process of electroless plating a metal on non-conductive surfaces. Another patent also focuses on a similar solution, emphasizing its utility in electroless plating processes.

Career Highlights

Wenjia Zhou is currently employed at Rohm & Haas Electronic Materials LLC, where he continues to develop innovative materials and methods. His expertise in the field has positioned him as a key contributor to advancements in electronic materials.

Collaborations

Wenjia Zhou collaborates with talented individuals such as Suk Kwan Kwong and Dennis Chit Yiu Chan. These partnerships enhance the innovative potential of his projects and contribute to the success of their collective endeavors.

Conclusion

Wenjia Zhou's work exemplifies the spirit of innovation in the field of electronic materials. His patents and collaborations reflect a commitment to advancing technology and improving processes in electroless plating.

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