Wenhua Yang

Title: Innovations of Wenhua Yang in Copper-Copper Bonding Technology.

Introduction

Wenhua Yang is a notable inventor based in Hefei, China. He has made significant contributions to the field of three-dimensional packaging technology. His innovative approach to bonding methods has garnered attention in the industry.

Latest Patents

Wenhua Yang holds a patent for a bonding method for copper-copper metal using hydrazine hydrate. This patent, which is classified under the technical field of three-dimensional packaging, outlines a process that involves pretreating a copper-plated surface of a clean copper-plated substrate with hydrazine hydrate under a protective atmosphere. The method ensures that the copper-plated surface is maintained at a temperature between 50° C. and 90° C. Furthermore, it describes the procedure for subjecting multiple copper-plated substrates to pressurized bonding at temperatures ranging from 200° C. to 300° C. under the same protective atmosphere. This innovative bonding method is a testament to his expertise and creativity in the field.

Career Highlights

Wenhua Yang is affiliated with Anhui University, where he continues to advance research in materials science and engineering. His work has not only contributed to academic knowledge but also has practical applications in various industries.

Collaborations

Wenhua Yang has collaborated with colleagues such as Xin Huang and Chao Xie. These partnerships have fostered a collaborative environment that enhances research and innovation.

Conclusion

Wenhua Yang's contributions to the bonding methods for copper-copper metal highlight his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in the field of three-dimensional packaging.