Wendy Lee Wilkins

Title: The Innovations of Wendy Lee Wilkins

Introduction

Wendy Lee Wilkins is a notable inventor based in Eau Claire, WI (US). She has made significant contributions to the field of electronics through her innovative patents. Her work focuses on advanced manufacturing techniques that enhance the efficiency and functionality of electronic components.

Latest Patents

Wendy holds a patent for "Die-first multi-chip modules and methods of manufacture." This patent describes methods for creating a multi-component module that utilizes a reusable carrier substrate. The substrate is light transmissive in a frequency range of an adhesive that can be ablated by light from an excimer laser. The process involves adhering an electronic component, such as a chip or die, to the reusable carrier substrate with the adhesive. An interconnect structure is then fabricated on the electronic component to form a multi-component module. Finally, the excimer laser illuminates the reusable carrier substrate to ablate the adhesive, allowing for the removal of the multi-component module.

Career Highlights

Wendy is currently associated with Union Semiconductor Technology Corporation, where she continues to push the boundaries of electronic manufacturing. Her expertise in the field has led to advancements that benefit both the industry and consumers alike.

Collaborations

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Conclusion

Wendy Lee Wilkins exemplifies the spirit of innovation in the electronics industry. Her contributions through her patent demonstrate her commitment to advancing technology and improving manufacturing processes.