The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Nov. 30, 2003
Wendy Lee Wilkins, Eau Claire, WI (US);
Wendy Lee Wilkins, Eau Claire, WI (US);
Union Semiconductor Technology Corporation, Plymouth, MN (US);
Abstract
Methods of making a multi component module () utilize a reusable carrier substrate () where the reusable carrier substrate () is light transmissive in a frequency range of an adhesive () that is ablated by light of a certain frequency such as light from an excimer laser (). An electronic component (), such as a chip, die, or passive or active component, is adhered to the reusable carrier substrate () with the adhesive (). An interconnect structure () is fabricated on the electronic component () to form a multi component module (). The excimer laser () illuminates the reusable carrier substrate () with light in the frequency range after fabricating the interconnect structure () to ablate the adhesive () to remove the multi component module () from the reusable carrier substrate ().