Lanzhou, China

Wenda Wang

This inventor holds 1 USPTO granted patent. Top assignees: Institute of Earthquake Forecasting, Cea, Lanzhou Jiaotong University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenda Wang. Retrieved from https://idiyas.com/inventor/wenda-wang-4mrd1ody

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Wenda Wang: Innovator in Deformation Field Modeling

Introduction

Wenda Wang is a notable inventor based in Lanzhou, China. He has made significant contributions to the field of deformation field modeling, particularly through his innovative patent that integrates advanced observation data.

Latest Patents

Wenda Wang holds a patent for a "Three-dimensional deformation field modeling method fusing GNSS/InSAR observation data." This method involves several key components, including solving an InSAR line-of-sight velocity field, unifying spatial reference datums of GNSS and InSAR data, verifying the precision of InSAR results, and utilizing a least square method to achieve high-precision three-dimensional deformation fields. The method ensures accuracy by processing InSAR data with a high-precision time series approach and correcting long-wavelength errors based on differences in spatial reference datums.

Career Highlights

Wenda Wang has worked at prominent institutions such as Lanzhou Jiaotong University and the Institute of Earthquake Forecasting. His work has focused on enhancing the accuracy and reliability of deformation modeling techniques, which are crucial for various applications in geosciences.

Collaborations

Wenda has collaborated with notable colleagues, including Xiaoning Su and Qian Zhao, who have contributed to his research endeavors.

Conclusion

Wenda Wang's innovative work in three-dimensional deformation field modeling showcases his expertise and commitment to advancing scientific understanding in this critical area. His contributions are paving the way for more accurate geospatial analyses and applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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