This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: China Unionpay. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Wenchuan Wu and His Patent for SDK Repair
Introduction
Wenchuan Wu is an inventor associated with Shanghai, China, and China UnionPay. His patent work addresses software development kit (SDK) reliability and repair.
Latest Patents
Wu is named on 1 patent: “SDK Repair Method and Apparatus, Terminal, Device, System, and Medium.” The disclosure describes a method that gathers SDK, host, and anomaly information, then assesses the impact of different anomaly types. Using those assessments and preset grading rules, the system selects a repair policy and delivers it to a user terminal, where the policy can be applied to repair the target SDK.
Career Highlights
Wu’s listed patent reflects work on diagnosing SDK anomalies and coordinating repairs across software components. The disclosed approach uses anomaly impact assessments to guide repair decisions.
Collaborations
Wu’s listed coworkers include Ji Xia and Xi Shen. The patent disclosure concerns a repair process involving SDK information, host programs, and user terminals.
Conclusion
Wenchuan Wu’s patent focuses on a structured, impact-based method for identifying SDK issues and delivering appropriate repairs.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile