Shanghai, China

Wenbin Qi

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: China Unionpay. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenbin Qi. Retrieved from https://idiyas.com/inventor/wenbin-qi-3weebxxw

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Wenbin Qi

Introduction

Wenbin Qi is a notable inventor based in Shanghai, China. He has made significant contributions to the field of payment technology, particularly in the realm of Internet of Things (IoT) devices. His work focuses on enhancing payment methods and systems, which are increasingly vital in today's digital economy.

Latest Patents

Wenbin Qi holds a patent for a "Payment method, gateway device, server and storage medium." This invention provides a comprehensive solution for processing payments through IoT devices. The method involves obtaining target identification information and payment amounts from connected devices, facilitating seamless transactions through a gateway device. This innovation is crucial for the integration of payment systems with IoT technology.

Career Highlights

Wenbin Qi is currently employed at China UnionPay, a leading payment service provider in China. His role involves developing advanced payment solutions that cater to the evolving needs of consumers and businesses alike. His expertise in payment technology has positioned him as a key player in the industry.

Collaborations

Wenbin has collaborated with talented individuals such as Zhijie Xu and Weiqi Yu. Together, they have worked on various projects aimed at improving payment systems and enhancing user experiences in digital transactions.

Conclusion

Wenbin Qi's innovative contributions to payment technology demonstrate his commitment to advancing the field. His patent and work at China UnionPay highlight his role in shaping the future of digital payments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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