Taiyuan, China

Wenbin Feng

This inventor holds 1 USPTO granted patent. Top assignee: Taiyuan University of Technology. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenbin Feng. Retrieved from https://idiyas.com/inventor/wenbin-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2024

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Biography of Inventor Wenbin Feng

Introduction: Wenbin Feng is a notable inventor based in Taiyuan, China. He has made significant contributions to the field of metal cladding technology, particularly through his innovative patent.

Latest Patents: Wenbin Feng holds a patent for a "Continuous rolling device and method with interfacial temperature-force controllability for seamless metal cladding pipe." This invention discloses a continuous rolling device that includes a multi-roller skew rolling mill set, an interfacial temperature-force controlled rolling mill set, and a sizing and finishing mill set. The device is designed to enhance the efficiency and quality of seamless metal cladding pipes.

Career Highlights: Wenbin Feng is affiliated with Taiyuan University of Technology, where he engages in research and development activities. His work focuses on advancing technologies related to metal processing and manufacturing.

Collaborations: Throughout his career, Wenbin Feng has collaborated with esteemed colleagues, including Tao Wang and Ce Ji. These partnerships have contributed to the development of innovative solutions in their field.

Conclusion: Wenbin Feng's contributions to the field of metal cladding technology exemplify his dedication to innovation. His patent reflects a commitment to improving manufacturing processes, and his collaborations with fellow researchers further enhance the impact of his work.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…