Shenyang, China

Wen Wang

This inventor holds 2 USPTO granted patents. Top assignee: Iowa State University Research Foundation Inc.. Active years: 2007-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen Wang. Retrieved from https://idiyas.com/inventor/wen-wang-tb0jm654

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Location History:

  • Ames, IA (US) (2007)
  • Shenyan, CN (2012)

Company Filing History:


Years Active: 2007-2012

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Wen Wang

Introduction

Wen Wang is a prominent inventor based in Shenyang, China. She has made significant contributions to the field of materials science, particularly in the development of advanced alloys. With a total of 2 patents to her name, her work continues to influence the industry.

Latest Patents

Wen Wang's latest patents include an innovative alloy that incorporates a platinum-group metal, nickel, and aluminum. This alloy is designed to achieve a specific phase constitution, featuring both γ-Ni and γ'-NiAl phases. Additionally, her patents encompass a coating that utilizes this advanced alloy, showcasing her commitment to enhancing material properties.

Career Highlights

Wen Wang is affiliated with the Iowa State University Research Foundation Inc., where she conducts her research and development activities. Her work has garnered attention for its potential applications in various industries, including aerospace and automotive sectors.

Collaborations

Wen collaborates with Brian M. Gleeson, a fellow researcher, to further explore the capabilities and applications of her patented technologies.

Conclusion

Wen Wang's innovative work in alloy development and her contributions to materials science highlight her role as a leading inventor in her field. Her patents reflect a dedication to advancing technology and improving material performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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