Wen-Sen Tang

Title: Innovations of Wen-Sen Tang

Introduction

Wen-Sen Tang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of technology, particularly in the area of manufacturing methods for electronic components. His innovative approach has led to the development of a unique patent that enhances the efficiency of electronic devices.

Latest Patents

Wen-Sen Tang holds a patent for a "Metal bump structure and manufacturing method thereof and driving substrate." This patent describes a manufacturing method that involves creating a metal bump structure on a driving base. The process includes forming at least one pad and an insulating layer on the driving base, with a patterned metal layer applied to the exposed surface of the pad. An electro-less plating process is then utilized to form metal bumps, which are crucial for improving the performance of electronic devices. He has 1 patent to his name.

Career Highlights

Wen-Sen Tang is currently employed at Unimicron Technology Corporation, a leading company in the electronics manufacturing sector. His work at Unimicron has allowed him to apply his innovative ideas in a practical setting, contributing to the advancement of technology in the industry.

Collaborations

Wen-Sen Tang has collaborated with several talented individuals, including Tzyy-Jang Tseng and Ming-Ru Chen. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Wen-Sen Tang's contributions to the field of electronics through his innovative patent and collaborative efforts highlight his role as a significant inventor in the industry. His work continues to influence the development of advanced manufacturing methods, paving the way for future innovations.