Wen-Hun Tung

Title: Innovations by Wen-Hun Tung in Semiconductor Technology

Introduction

Wen-Hun Tung is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in methods that enhance the performance and reliability of semiconductor devices. His innovative approach has led to the development of a patented method that addresses critical challenges in the manufacturing process.

Latest Patents

Wen-Hun Tung holds a patent for a "Method for preventing or reducing anodic Cu corrosion during CMP." This invention provides a method and apparatus designed to prevent or reduce corrosion of copper-containing features in semiconductor wafers during the chemical mechanical polishing (CMP) process. The method involves polishing semiconductor wafer surfaces that include copper-filled anisotropically etched features, ensuring that the polishing pad surface is in electrically conductive communication with a conductive polishing platen. This innovative approach enhances the reliability of semiconductor devices by mitigating corrosion issues.

Career Highlights

Wen-Hun Tung is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to focus on advancing semiconductor manufacturing techniques. With a patent portfolio that includes 1 patent, he has established himself as a key contributor to the field.

Collaborations

Wen-Hun Tung has collaborated with notable colleagues, including Tsu Shih and Kun Ku Hung. These collaborations have fostered an environment of innovation and have contributed to the development of advanced semiconductor technologies.

Conclusion

Wen-Hun Tung's contributions to semiconductor technology through his innovative patent demonstrate his commitment to enhancing the manufacturing process. His work not only addresses critical challenges but also paves the way for future advancements in the industry.