This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Win Coat Corporation. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Innovations of Wen-Hsu Lien in Microneedle Technology
Introduction
Wen-Hsu Lien is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of medical technology, particularly in the development of microneedle patches. His innovative work aims to enhance the delivery of active ingredients in medical applications.
Latest Patents
Wen-Hsu Lien holds a patent for a "Multi-layered microneedle patch and method of manufacturing the same." This invention features a microneedle patch that includes a substrate part and multiple needle parts protruding from it. The substrate part consists of a diffusion-proof layer and a base, while each needle part is designed with a needle tip, a diffusion-proof layer, and a base. The unique design of the diffusion-proof layers prevents active ingredients from diffusing to the base, thereby controlling the quantity of active ingredients carried by the needle tips.
Career Highlights
Wen-Hsu Lien is associated with Win Coat Corporation, where he continues to innovate in the field of microneedle technology. His work has the potential to revolutionize how medications are delivered, making treatments more effective and less invasive.
Collaborations
Wen-Hsu Lien collaborates with talented individuals such as Ta-Jo Liu and Wan-Hua Li, who contribute to the advancement of their projects and research initiatives.
Conclusion
Wen-Hsu Lien's contributions to microneedle technology exemplify the innovative spirit of modern inventors. His work not only enhances medical treatments but also paves the way for future advancements in the field.