Tucheng, Taiwan

Wen-Chung Hsieh

This inventor holds 1 USPTO granted patent. Top assignee: Hon Hai Precision Industry Co., Ltd.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Chung Hsieh. Retrieved from https://idiyas.com/inventor/wen-chung-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovations of Wen-Chung Hsieh

Introduction

Wen-Chung Hsieh is a notable inventor based in Tu-Chen, Taiwan. He has made significant contributions to the field of engineering, particularly with his innovative designs and patents. His work is recognized for its impact on modern technology and industry.

Latest Patents

Wen-Chung Hsieh holds a patent for a high rise connector. This invention showcases his ability to create solutions that enhance structural integrity and efficiency in construction. His patent portfolio reflects his commitment to advancing engineering practices.

Career Highlights

Hsieh is currently employed at Hon Hai Precision Industry Co., Ltd., a leading technology company known for its manufacturing prowess. His role at the company allows him to collaborate with other talented engineers and contribute to groundbreaking projects.

Collaborations

Throughout his career, Wen-Chung Hsieh has worked alongside talented individuals such as Yun-Tie Weng and She Min Cai. Their collaborative efforts have led to innovative solutions and advancements in their respective fields.

Conclusion

Wen-Chung Hsieh's contributions to engineering and innovation are commendable. His patent for the high rise connector exemplifies his inventive spirit and dedication to improving technology. His work continues to inspire future generations of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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