Taipei, Taiwan

Wen-Chieh Liang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Molex Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Chieh Liang. Retrieved from https://idiyas.com/inventor/wen-chieh-liang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Wen-Chieh Liang and Electrical Connector Innovation.

Introduction

Wen-Chieh Liang is an inventor associated with Taipei, Taiwan, and Molex Corporation. Liang’s patent work concerns electrical connectors designed to connect securely to circuit boards and conducting wires.

Latest Patents

The provided information identifies one patent associated with Liang: “Electrical Connector and Electrical Connector Combination Fixable on a Circuit Board and to Conducting Wires.” The invention describes a connector with an insulating housing, conductive terminals, and conducting wires. A second insulating housing and additional terminals fit into a receiving cavity, forming a connector assembly that can be fixed to a circuit board and connected to wires. Liang is credited with 1 patent in the information provided.

Career Highlights

Liang is associated with Molex Corporation, a company that develops electronic and connectivity products. The patent reflects work on connector structures that integrate circuit-board attachment with wire connections.

Collaborations

The provided information lists You-Sheng Chen and Jing Liu as Liang’s coworkers. It does not specify whether they collaborated on the patent.

Conclusion

Wen-Chieh Liang’s identified patent focuses on a practical electrical connector assembly for circuit boards and conducting wires, reflecting an area of innovation associated with Molex Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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