Wen-Chia Ou

Title: Innovations of Wen-Chia Ou in Semiconductor Technology.

Introduction

Wen-Chia Ou is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device and its fabrication method.

Latest Patents

Wen-Chia Ou holds a patent for a semiconductor device and method of fabricating the same. This patent outlines a method that includes several steps, such as forming a plurality of doped regions in a substrate. A first dielectric layer is then formed on the substrate, followed by the creation of first and second contacts within this layer, which connect to the doped regions. A memory element is formed on the first dielectric layer and is electrically connected to the second contact. Subsequently, a second dielectric layer is formed around the memory element, and a conductive line is created within this layer, ensuring that its top surface aligns with that of the memory element. This conductive line is electrically connected to the first contacts.

Career Highlights

Wen-Chia Ou is currently employed at Winbond Electronics Corporation, where he continues to advance semiconductor technologies. His work has been instrumental in enhancing the efficiency and functionality of semiconductor devices.

Collaborations

Wen-Chia Ou collaborates with talented individuals such as Chih-Chao Huang and Min-Chih Wei, who contribute to the innovative environment at Winbond Electronics Corporation.

Conclusion

Wen-Chia Ou's contributions to semiconductor technology exemplify the impact of innovation in the field. His patent and ongoing work at Winbond Electronics Corporation highlight his role as a key inventor in advancing semiconductor devices.