This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Phoenix Pioneer Technology Co., Ltd.. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Innovator Spotlight: Wen-Chang Chen
Introduction
Wen-Chang Chen is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, showcasing his innovative spirit and dedication to advancing electronic packaging solutions.
Latest Patents
Wen-Chang holds a patent for a groundbreaking invention titled "Semiconductor package carrier board, method for fabricating the same, and electronic package having the same." This invention introduces a semiconductor package carrier board designed to enhance heat dissipation and mitigate overheating issues in electronic devices. The method involves forming a graphene layer on a circuit structure, which acts as an insulating heat dissipating layer. The graphene's superior heat conduction properties greatly surpass those of traditional ink used as solder resist, allowing for rapid dissipation of heat and preventing accumulation on the carrier board.
Career Highlights
Currently, Wen-Chang is employed at Phoenix Pioneer Technology Co., Ltd., where he continues to contribute to innovative projects within the semiconductor industry. His expertise in material science and engineering has positioned him as a leader in developing advanced electronic packaging technologies.
Collaborations
Wen-Chang collaborates with talented individuals such as Pao-Hung Chou and Chun-Hsien Yu, where they work together to push the boundaries of technology and create solutions that address critical challenges faced by the electronics sector.
Conclusion
Wen-Chang Chen's contributions to semiconductor technology through his innovations and patent illustrate his commitment to advancing the field. His work not only enhances the efficiency and performance of electronic devices but also sets a foundation for future technological developments in the industry. As the demand for effective thermal management in electronic packaging grows, inventions like his will become increasingly vital in shaping the future of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile