Weitong Shi

Title: Weitong Shi: Innovator in Thermosetting Resin Compositions

Introduction

Weitong Shi is a notable inventor based in Shandong, China. He has made significant contributions to the field of thermosetting resin compositions, particularly in applications related to semiconductor devices. With a total of 2 patents, his work has garnered attention for its innovative approaches and practical applications.

Latest Patents

Weitong Shi's latest patents include advancements in low exothermic thermosetting resin compositions. These compositions are particularly useful as underfill sealants for mounting semiconductor devices onto circuit boards. His invention addresses the need for materials that are controllably reworkable under appropriate conditions. Notably, these compositions possess an exotherm under 300 J/g and demonstrate package stability at 55°C for 7 days. This characteristic eliminates the need for special packaging during air transport, making them more accessible for international shipping. Additionally, he has developed elastomer toughened radiation curable adhesives, further showcasing his expertise in adhesive technologies.

Career Highlights

Weitong Shi is currently employed at Henkel Corporation, where he continues to innovate in the field of materials science. His work has not only advanced the technology behind thermosetting resins but has also contributed to the efficiency and reliability of semiconductor manufacturing processes.

Collaborations

Some of his notable coworkers include JoAnn DeMarco and Shabbir Attarwala, who have collaborated with him on various projects within Henkel Corporation.

Conclusion

Weitong Shi's contributions to the field of thermosetting resin compositions highlight his role as a leading inventor in the industry. His innovative patents and ongoing work at Henkel Corporation continue to influence the development of advanced materials for semiconductor applications.