Hsinchu, Taiwan

Weiming Chris Chen

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Weiming Chris Chen. Retrieved from https://idiyas.com/inventor/weiming-chris-chen-o91w24jf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Weiming Chris Chen: Innovator in Chiplet Interposer Technology

Introduction: Weiming Chris Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative work on chiplet interposers. His expertise and creativity have led to advancements that enhance the performance and efficiency of electronic devices.

Latest Patents: Weiming Chris Chen holds 1 patent for his invention related to chiplet interposers. This patent describes packages and methods for forming packages that include interposers made of dielectric materials. The interposers feature a redistribution structure over the substrate, which includes metallization patterns stitched together through a patterning process involving multiple lateral overlapping patterning exposures.

Career Highlights: Chen is currently employed at Taiwan Semiconductor Manufacturing Co., Ltd., a leading company in the semiconductor industry. His role at TSMC allows him to work on cutting-edge technologies that shape the future of electronics.

Collaborations: Throughout his career, Weiming Chris Chen has collaborated with notable colleagues, including Chen-Hua Douglas Yu and Shang-Yun Hou. These partnerships have fostered an environment of innovation and creativity, contributing to the success of their projects.

Conclusion: Weiming Chris Chen is a key figure in the development of chiplet interposer technology, with a focus on enhancing semiconductor packaging. His contributions continue to influence the industry and pave the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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