This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Huawei Technologies Co., Limited. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Weijian Pan: Innovator in Power Supply Packaging Technologies
Introduction
Weijian Pan is a notable inventor based in Shanghai, China. He has made significant contributions to the field of power supply packaging technologies. His innovative work has led to the development of a unique packaged module that enhances the efficiency of power components.
Latest Patents
Weijian Pan holds a patent for a "PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module." This invention relates to power supply packaging technologies and includes a packaged module with a PCB and a power component. The design features a pin exposed outside the packaged module, allowing for effective communication connections through surface-layer copper of the PCB.
Career Highlights
Weijian Pan is currently employed at Huawei Technologies Co., Limited, where he continues to push the boundaries of innovation in technology. His work focuses on improving the efficiency and functionality of power supply systems.
Collaborations
Throughout his career, Weijian Pan has collaborated with talented individuals such as Zhixiang Hu and Dan Yang. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Weijian Pan's contributions to power supply packaging technologies exemplify the spirit of innovation. His patent and ongoing work at Huawei Technologies Co., Limited highlight his commitment to advancing the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile