Niskayuna, NY, United States of America

Wei Zhang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ge Vernova Infrastructure Technology LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei Zhang. Retrieved from https://idiyas.com/inventor/wei-zhang-nuzmc1sn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Wei Zhang and an Integrated Electric Machine Invention.

Introduction

Wei Zhang is an inventor associated with Niskayuna, New York, and GE Vernova Infrastructure Technology LLC. His patent work includes an electric machine design that integrates electromagnetic pumping with direct-cooled windings.

Latest Patents

Zhang is credited with 1 patent: “Electric Machine with Integrated Electromagnetic Pumping Scheme for Direct Cooled Windings.” The invention describes an integrated electric machine with a stator, a rotor positioned within the stator, and an electromagnetic pumping system connected to the stator. The system uses conductive fluid and electromagnetic pump windings to move the fluid through coolant pathways in the direct-cooled windings.

Career Highlights

Zhang’s listed patent reflects work on integrating electromagnetic pumping and winding cooling within an electric machine. The design brings the pumping system and coolant pathways together as part of the machine’s cooling arrangement.

Collaborations

Zhang’s listed coworkers include Matthew R. Martin and John R. Yagielski. Their names appear alongside his in connection with the patent.

Conclusion

Wei Zhang’s patent describes an integrated electric machine that uses electromagnetic pumping to circulate conductive fluid through direct-cooled winding pathways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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