Wei-Wei Liu

Title: Innovations of Wei-Wei Liu

Introduction

Wei-Wei Liu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work focuses on electronic device packaging and semiconductor structures, showcasing his expertise in innovative manufacturing methods.

Latest Patents

Wei-Wei Liu's latest patents include an electronic device package and a method of manufacturing the same. This electronic device package features a substrate, a conductive trace, a passivation layer, and upper wiring. The conductive trace is strategically placed over the substrate, with a body portion and a wider cap portion. The passivation layer covers the conductive trace, while the upper wiring connects electrically to the cap portion through an opening in the passivation layer.

Another notable patent is the semiconductor package structure and method for manufacturing the same. This structure includes a semiconductor design with multiple surfaces defining a through-silicon via (TSV). The conductive trace is positioned adjacent to the semiconductor surfaces, and a tenting structure covers the TSV, creating a defined cavity.

Career Highlights

Wei-Wei Liu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the efficiency and effectiveness of electronic devices.

Collaborations

Throughout his career, Wei-Wei Liu has collaborated with notable colleagues, including Huei-Siang Wong and Lu-Ming Lai. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Wei-Wei Liu's contributions to semiconductor technology and electronic device packaging highlight his role as a leading inventor in the field. His innovative patents and collaborations reflect his commitment to advancing technology in meaningful ways.