Company Filing History:
Years Active: 2024
Title: Wei-Tien Shen: Innovator in Semiconductor Packaging
Introduction: Wei-Tien Shen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work is particularly focused on enhancing the functionality and efficiency of package substrates.
Latest Patents: Wei-Tien Shen holds a patent for a "Package substrate, package using the same, and method of manufacturing the same." This invention provides a package substrate that includes a substrate with a cavity hole, housing a semiconductor device. The semiconductor device features a first terminal side and a second terminal side, with redistribution structures designed to electrically couple to various pads on both sides of the device. This innovation is crucial for improving the performance and reliability of semiconductor packages.
Career Highlights: Wei-Tien Shen is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His role in the company has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor manufacturing.
Collaborations: Wei-Tien Shen has collaborated with notable colleagues, including Hungen Hsu and Kuo-Ching Hsu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion: Wei-Tien Shen's contributions to semiconductor packaging through his patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of semiconductor technology.