Wei-Teng Chang

Title: Wei-Teng Chang: Innovator in Chip Packaging Technology

Introduction: Wei-Teng Chang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent related to chip packages. His work is essential in enhancing the performance and reliability of electronic devices.

Latest Patents: Wei-Teng Chang holds a patent titled "Structure and formation method of chip package with protective lid." This patent describes a package structure and a formation method that includes disposing a chip structure over a substrate. The method involves forming a first adhesive element directly on the chip structure, which has a specific thermal conductivity. Additionally, a second adhesive element is formed on the chip structure, possessing a greater thermal conductivity than the first. The protective lid is then attached to the chip structure through both adhesive elements, ensuring optimal performance.

Career Highlights: Wei-Teng Chang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves developing advanced packaging solutions that contribute to the efficiency and effectiveness of semiconductor devices.

Collaborations: Throughout his career, Wei-Teng has collaborated with notable colleagues, including Meng-Tsung Kuo and Hui-Chang Yu. These partnerships have fostered innovation and have been instrumental in advancing their shared goals in semiconductor technology.

Conclusion: Wei-Teng Chang's contributions to chip packaging technology exemplify the importance of innovation in the semiconductor industry. His patent and collaborative efforts continue to influence the development of more efficient electronic devices.