Company Filing History:
Years Active: 2014-2025
Title: Innovations of Wei-Sheng Cheng
Introduction
Wei-Sheng Cheng is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. With a total of seven patents to his name, Cheng's work has had a notable impact on various applications in electronics and manufacturing.
Latest Patents
Cheng's latest patents include a method for smoothing the surface of copper foil and a copper foil structure with a conductive organic anti-oxidation layer. The first patent outlines a comprehensive method that involves a first electropolishing process, followed by a pickling process, and concludes with a second electropolishing process. This innovative approach enhances the quality and performance of copper foil. The second patent presents a copper foil structure that integrates a copper foil layer with a conductive organic anti-oxidation layer, which includes both an organic antioxidant and a conductive polymer. This advancement is crucial for improving the longevity and efficiency of electronic components.
Career Highlights
Wei-Sheng Cheng is currently associated with Nan Ya Plastics Corporation, where he continues to push the boundaries of innovation in materials technology. His work has not only contributed to the company's success but has also positioned him as a key figure in the industry.
Collaborations
Cheng has collaborated with notable colleagues such as Te-Chao Liao and Sen-Huang Hsu. Their combined expertise has fostered a productive environment for innovation and development within their projects.
Conclusion
Wei-Sheng Cheng's contributions to the field of copper foil technology exemplify the spirit of innovation. His patents reflect a commitment to advancing materials science, which is essential for the future of electronics.