Wei-Luen Hsu

Title: Wei-Luen Hsu: Innovator in Semiconductor Packaging

Introduction: Wei-Luen Hsu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package structure.

Latest Patents: Wei-Luen Hsu holds 1 patent for his invention titled "Semiconductor package structure and method of manufacturing the same." This patent describes a semiconductor package structure that includes a chip unit, a package unit, and an electrode unit. The chip unit consists of at least one semiconductor chip, which features an upper surface, a lower surface, and a surrounding peripheral surface. The semiconductor chip is equipped with a first conductive pad and a second conductive pad located on its lower surface. The package unit encompasses a package body that covers both the upper surface and the surrounding peripheral surface of the semiconductor chip. Additionally, the package body has a first lateral portion and a second lateral portion formed on opposite sides. The electrode unit includes a first electrode structure that covers the first lateral portion and a second electrode structure that covers the second lateral portion, ensuring electrical contact with the conductive pads.

Career Highlights: Wei-Luen Hsu is currently associated with Inpaq Technology Co., Ltd., where he continues to advance semiconductor packaging technologies. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations: Wei-Luen Hsu has collaborated with notable colleagues, including Chu-Chun Hsu and Hong-Sheng Ke. Their combined efforts contribute to the ongoing advancements in semiconductor technology.

Conclusion: Wei-Luen Hsu's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent reflects a significant advancement in the field, showcasing his dedication to improving semiconductor structures.