Wei-Kong Chia is a notable inventor based in Los Altos, California. He has made significant contributions to the field of electronic circuit design, holding a total of 3 patents. His work focuses on improving the efficiency and effectiveness of circuit placement and layout.

Latest Patents

Wei-Kong Chia's latest patents include innovative methods that enhance the design and placement of electronic circuits. One of his patents, titled "Method and apparatus of relative datapath cell placement with structure bonding," discloses a technique for the relative placement of datapath cell instances in various structures. This invention aims to create a desirable structure while minimizing the length of nets by strategically placing pseudo cells, pseudo pins, and pseudo nets. Another significant patent is the "Method for mixed placement of structured and non-structured circuit," which resides in a computer-aided design system. This invention improves substrate area utilization by effectively segregating structural and non-structural zones in chip or board layouts.

Career Highlights

Throughout his career, Wei-Kong Chia has worked with prominent companies such as Arcadia Design Systems, Inc. and Hitachi Micro Systems, Inc. His experience in these organizations has contributed to his expertise in electronic circuit design and placement.

Collaborations

Wei-Kong Chia has collaborated with notable professionals in his field, including Tsu-Wei Ku and Dong-Ru Shieh. These collaborations have further enriched his work and innovations in circuit design.

Conclusion

Wei-Kong Chia's contributions to electronic circuit design through his patents and collaborations highlight his innovative spirit and dedication to advancing technology. His work continues to influence the field and inspire future innovations.

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