This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2021.
Company Filing History:
Years Active: 2021
Title: Innovations of Wei Jing in Printed Circuit Board Technology
Introduction
Wei Jing is a notable inventor based in Dongguan, China. He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative designs aim to enhance the efficiency and functionality of electronic devices.
Latest Patents
Wei Jing holds a patent for a multilayer printed circuit board and communications device. This invention features a pad array on the surface of the multilayer PCB, which includes at least one padding unit. Each padding unit consists of a first pad and a second pad that are adjacent to each other. Both pads are connected to a first Z-directed transmission line located in a Z-directed groove. This design reduces the number of Z-directed grooves that need to be bypassed when wiring a signal wire on a signal layer, making the wiring process easier compared to prior art. Additionally, the application provides a corresponding communications device.
Career Highlights
Wei Jing is currently employed at Huawei Technologies Co., Limited, a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His work at Huawei has allowed him to contribute to cutting-edge technology and innovation in the electronics industry.
Collaborations
Wei Jing has collaborated with notable colleagues such as Feng Gao and Ertang Xie. Their teamwork has fostered an environment of innovation and creativity, leading to advancements in PCB technology.
Conclusion
Wei Jing's contributions to printed circuit board technology exemplify the spirit of innovation in the electronics field. His patent reflects a commitment to improving the efficiency of electronic devices, showcasing his role as a significant inventor in the industry.