Company Filing History:
Years Active: 2019-2025
Title: Wei-Jen Wang: Innovator in Electronic Structures
Introduction
Wei-Jen Wang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronic structures, holding a total of 7 patents. His work focuses on enhancing the efficiency and functionality of electronic packaging.
Latest Patents
One of his latest patents is titled "Electronic structure having a protrusion structure disposed in a gap between a circuit pattern structure and a packaging structure." This invention includes a packaging structure, a circuit pattern structure, an underfill, and a protrusion structure. The protrusion structure is designed to facilitate the distribution of the underfill in the gap between the circuit pattern and packaging structures. Another notable patent is "Electronic package structure and method for manufacturing the same." This patent outlines an electronic package structure that includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The encapsulant surrounds the interconnection element and partially covers the insulation layer, enhancing the overall integrity of the electronic package.
Career Highlights
Wei-Jen Wang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing electronic packaging solutions.
Collaborations
Throughout his career, Wei-Jen has collaborated with talented individuals such as Po-Jen Cheng and Fu-Yuan Chen. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Wei-Jen Wang is a key figure in the realm of electronic structures, with a proven track record of innovation and collaboration. His contributions continue to shape the future of semiconductor technology.