Cherry Hill, NJ, United States of America

Wei H Tsien

This inventor holds 1 USPTO granted patent. Top assignee: Rca Inc.. Active years: 1983.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei H Tsien. Retrieved from https://idiyas.com/inventor/wei-h-tsien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1983

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1 patent (USPTO):Explore Patents

Title: Wei H. Tsien: Innovator in Coating Adhesion Testing

Introduction

Wei H. Tsien is a notable inventor based in Cherry Hill, NJ (US). He has made significant contributions to the field of coating adhesion testing. His innovative approach has led to the development of a method that is both effective and nondestructive.

Latest Patents

Wei H. Tsien holds 1 patent for his invention related to coating adhesion testing. This method involves applying a force to a sample using a plunger and supporting ring apparatus. The force is increased laterally while measuring both the force and the resulting deflection. The test is terminated when there is an abrupt change in the slope of the force-deflection curve, allowing for the precise measurement of the force required to achieve this condition.

Career Highlights

Wei H. Tsien is associated with RCA Inc., where he has been able to apply his expertise in coating adhesion testing. His work has contributed to advancements in the field, showcasing his commitment to innovation and quality.

Collaborations

Throughout his career, Wei has collaborated with notable colleagues such as Joseph H. McCusker and Barry Jay Thaler. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Wei H. Tsien is a distinguished inventor whose work in coating adhesion testing exemplifies innovation in engineering. His contributions continue to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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