Wei-De Chien

Title: Innovations of Wei-De Chien in System-on-Chip Technology

Introduction

Wei-De Chien is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of System-on-Chip (SoC) technology. His innovative work focuses on enhancing the efficiency and functionality of SoC designs.

Latest Patents

Wei-De Chien holds a patent for a "Carrier structure of SoC with custom interface." This invention discloses a carrier structure that includes a substrate, at least one common die, at least one custom interface, and a molding compound. The common die and the custom interface are disposed on the substrate. The molding compound is utilized to package the common die, which electrically connects to both the substrate and the custom interface. This carrier structure allows for the formation of a complete SoC by connecting to an expansive die through the custom interface. The design enables testing and certification of the common die in advance, thereby reducing and simplifying the development procedures of the SoC.

Career Highlights

Wei-De Chien has worked with prominent organizations such as the National Chip Implementation Center and the National Applied Research Laboratories. His experience in these institutions has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Some of his notable coworkers include Chin-Long Wey and Chun-Ming Huang. Their collaborative efforts have likely played a role in advancing the projects they have worked on together.

Conclusion

Wei-De Chien's contributions to SoC technology through his innovative patent demonstrate his commitment to enhancing electronic design. His work continues to influence the field and pave the way for future advancements in semiconductor technology.