San Jose, CA, United States of America

Wei Dai

This inventor holds 7 USPTO granted patents and 1 published patent application. Top assignees: Apple Inc., Arista Networks, Inc.. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei Dai. Retrieved from https://idiyas.com/inventor/wei-dai-p2y3lw3u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 71.4

Average Co-Inventor Count = 9.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2022-2026

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7 patents (USPTO):Explore Patents

Title: Wei Dai: A Trailblazer in Innovative Packaging Solutions

Introduction

Wei Dai, an accomplished inventor based in San Jose, California, has made significant contributions to the field of packaging technology. With a total of four patents to his name, Dai has demonstrated his commitment to innovation and improving existing systems in the industry.

Latest Patents

Among his patents, Wei Dai's latest innovations focus on enhancing packaging methods, addressing both functionality and efficiency. These developments reflect his proactive approach to solving practical problems in the packaging domain, showcasing his talent for generating creative solutions.

Career Highlights

Wei Dai has had the privilege of working with prominent technology companies such as Apple Inc. and Arista Networks, Inc. His experience in these dynamic environments has enriched his understanding of the market needs and has guided his efforts in developing impactful inventions.

Collaborations

Throughout his career, Dai has collaborated with talented individuals, including colleagues Christopher M. Caniglio and Richard P. Howarth. These partnerships have likely fostered an environment of innovation, sparking creativity and advancing packaging technologies in their respective projects.

Conclusion

Wei Dai's contributions to the world of packaging are noteworthy, with a career underscored by innovation and collaboration. As he continues to push the boundaries of his field, his work will undoubtedly influence future advancements in packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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