Taoyuan, Taiwan

Wei-Chun Li

This inventor holds 1 USPTO granted patent. Top assignee: Tdk Taiwan Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Chun Li. Retrieved from https://idiyas.com/inventor/wei-chun-li-915y4h4o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Wei-Chun Li: Innovator in Coil Module Technology

Introduction

Wei-Chun Li is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of coil module technology. His innovative designs have led to advancements in various applications, showcasing his expertise and creativity.

Latest Patents

Wei-Chun Li holds a patent for a coil module. This coil module includes a coil assembly, a first induction substrate, a second induction substrate, and an adhesive element. The coil assembly features a winding axis and is positioned on the first induction substrate. The first induction substrate is placed on the second induction substrate. The adhesive element covers both substrates and consists of a first adhesive portion and a second adhesive portion. When viewed from a direction perpendicular to the winding axis, these adhesive portions are located on different planes. This innovative design enhances the functionality and efficiency of coil modules.

Career Highlights

Wei-Chun Li is currently associated with TDK Taiwan Corporation. His work at TDK has allowed him to focus on developing cutting-edge technologies in the electronics sector. His contributions have been instrumental in advancing the company's product offerings and maintaining its competitive edge in the market.

Collaborations

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Conclusion

Wei-Chun Li's innovative work in coil module technology exemplifies his dedication to advancing the field. His patent and contributions at TDK Taiwan Corporation highlight his role as a key player in the electronics industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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