This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignee: Wistron Neweb Corporation. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025-2026
Title: Wei Chun Chen - Innovator in Buffer Structure Technology.
Introduction
Wei Chun Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of packaging technology, particularly through his innovative designs and methods.
Latest Patents
Wei Chun Chen holds a patent for a "Buffer structure, packaging set, and buffer structure forming method." This invention includes a buffer structure that consists of at least one internal main layer, at least one external main layer, and a rib portion. The design features an accommodating space formed by the inner side of the internal main layer, while the external main layer surrounds the outer side of the internal main layer. The rib portion is strategically located between two parallel first folding lines, creating a ring shape that enhances the structural integrity of the packaging.
Career Highlights
Wei Chun Chen is currently employed at Wistron Neweb Corporation, where he continues to develop innovative solutions in packaging technology. His work has been instrumental in advancing the efficiency and effectiveness of packaging designs.
Collaborations
He collaborates with talented coworkers, including Pei Shan Yu and Hsiao Hsuan Huang, contributing to a dynamic team environment that fosters innovation.
Conclusion
Wei Chun Chen's contributions to packaging technology through his patent demonstrate his commitment to innovation and excellence in his field. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile