Wei-Ching Chang

Title: Innovations by Wei-Ching Chang in Package Assembly Technology

Introduction

Wei-Ching Chang, an accomplished inventor based in New Taipei, Taiwan, has made significant contributions to the field of package assembly technology. With a patent to his name, Chang's innovative designs focus on enhancing the efficiency and effectiveness of electronic component packaging.

Latest Patents

Chang's most notable patent is a unique package assembly that integrates a substrate, an electronic component, and a cover. This design positions the electronic component within a chamber situated between the cover and the substrate. A critical feature of this assembly is its ability to incorporate a cooling liquid within a heat dissipation space of the cover. This cooling liquid is essential for dissipating the heat generated by the electronic component, enhancing the performance and longevity of electronic devices. Furthermore, the design allows for the cooling liquid to be filled directly into the chamber housing the electronic component, ensuring efficient heat management.

Career Highlights

Currently, Wei-Ching Chang is employed at Wiwynn Corporation, a company recognized for its cutting-edge technology solutions. Throughout his career, he has focused on innovation in assembly processes, striving to improve electronic product reliability through advancements in heat dissipation strategies.

Collaborations

Chang collaborates closely with his colleagues, Yi Cheng and Kang-Bin Mah, at Wiwynn Corporation. Together, they contribute to a dynamic work environment that fosters innovation and encourages the development of groundbreaking technologies.

Conclusion

Wei-Ching Chang stands out as a key inventor in the realm of package assembly technology. His innovative patent reflects a commitment to enhancing electronic component management through efficient heat dissipation solutions. As he continues his work at Wiwynn Corporation, Chang is poised to influence future advancements in the industry.