The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Nov. 21, 2022
Wiwynn Corporation, New Taipei, TW;
Yi Cheng, New Taipei, TW;
Wei-Ching Chang, New Taipei, TW;
Kang-Bin Mah, New Taipei, TW;
Li-Wei Chen, New Taipei, TW;
Zi-Ping Wu, New Taipei, TW;
Ting-Yu Pai, New Taipei, TW;
Wiwynn Corporation, New Taipei, TW;
Abstract
A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.