Company Filing History:
Years Active: 2004
Title: Innovations of Wei-Cheng Tseng in Semiconductor Technology.
Introduction
Wei-Cheng Tseng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly with his innovative designs that enhance the performance and efficiency of semiconductor packages.
Latest Patents
Wei-Cheng Tseng holds a patent for a "Window-type multi-chip semiconductor package." This invention features a design where a first chip and a second chip are mounted on a substrate with an opening, while a third chip is stacked on top of the first two. The design utilizes bonding wires that pass through the opening to interconnect the chips and connect them to the substrate. The chips are encapsulated with a first encapsulant on the substrate's surface and a second encapsulant on the opposite side, which protects the bonding wires. This arrangement allows for improved electrical transmission and performance by aligning the conductive elements in the same direction, thus shortening the bonding wires.
Career Highlights
Wei-Cheng Tseng is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work focuses on developing advanced packaging solutions that meet the growing demands of modern electronics.
Collaborations
One of his notable collaborators is Chin Te Chen, with whom he has worked on various projects to advance semiconductor technologies.
Conclusion
Wei-Cheng Tseng's innovative contributions to semiconductor packaging demonstrate his expertise and commitment to enhancing technology in this critical field. His patent for the window-type multi-chip semiconductor package is a testament to his ingenuity and the potential for improved electronic performance.