Company Filing History:
Years Active: 2003-2005
Title: Innovations of Inventor Wee Keong Liew
Introduction
Wee Keong Liew is a prominent inventor based in San Jose, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 7 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.
Latest Patents
One of his latest patents is titled "Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die." This patent discloses a BGA package that includes a multiplicity of power segments configured for power connection to an integrated circuit die. The substrate of the package features an integrated circuit die and a ground ring, along with a first power ring that has spaced apart segments arranged around the die. A second power ring is also formed around the die, and the package includes bonding wires for connecting the die to the power segments and ground ring. The design aims to improve electrical connections and protect the die and wires through encapsulation.
Another notable patent is "PBGA electrical noise isolation of signal traces." This patent describes a method for fabricating a semiconductor package with a 2-layer substrate that includes an array of solder balls. The method involves patterning signal traces on the substrate and creating grounded isolation traces to shield the signal traces from electrical noise. This innovation enhances the performance of semiconductor packages by reducing noise interference.
Career Highlights
Wee Keong Liew has had a successful career at LSI Logic Corporation, where he has contributed to various advancements in semiconductor technology. His expertise in integrated circuit packaging has positioned him as a key figure in the industry.
Collaborations
Throughout his career, Liew has collaborated with talented individuals such as Aritharan Thurairajaratnam and Hong Tee Lim. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in the field.
Conclusion
Wee Keong Liew's contributions to integrated circuit packaging have significantly impacted the semiconductor industry. His innovative patents and collaborations highlight his dedication to advancing technology and improving product performance.