We-Jei Ke

Title: We-Jei Ke: Innovator in Polymer Technology

Introduction

We-Jei Ke is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of polymer technology, holding three patents that showcase his innovative approach to manufacturing and materials science.

Latest Patents

One of his latest patents is a method of manufacturing a polymer printed circuit board. This method involves a sequential order of steps, including providing a material layer consisting of polymer, forming a circuit pattern on the material layer, and depositing metal nanoparticles on the laser-induced graphene of the circuit pattern. The process continues with the deposition of a metal layer on the nanoparticles, followed by pressing the circuit pattern to obtain the final polymer printed circuit board. Another notable patent is for a heat dissipation coating layer, which includes a binder and a core-shell heat dissipation filler. This filler is synthesized in a water bathing process and consists of a metal core and a shell made of a mixture of oxide and hydroxide.

Career Highlights

We-Jei Ke is currently associated with BGT Materials Limited, where he continues to push the boundaries of polymer technology. His work has been instrumental in developing advanced materials that enhance the performance and efficiency of electronic devices.

Collaborations

He collaborates with talented individuals such as Kuo-Hsin Chang and Jia-Cing Chen, contributing to a dynamic research environment that fosters innovation.

Conclusion

We-Jei Ke's contributions to polymer technology and his innovative patents reflect his dedication to advancing the field. His work not only enhances manufacturing processes but also paves the way for future developments in electronic materials.