Wayne T Smith

Title: Wayne T. Smith: Innovator in Electrophoretic Deposition

Introduction

Wayne T. Smith is a notable inventor based in Philadelphia, PA (US). He has made significant contributions to the field of electrophoretic deposition, showcasing his expertise through his innovative patent.

Latest Patents

Wayne T. Smith holds a patent for an "Apparatus and process for electrophoretic deposition." This invention presents a method and apparatus for the electrodeposition of insulating coatings, such as photoresists, ensuring uniform thickness throughout the coating. The apparatus includes one or more cathodes placed in a bath containing an electrophoretic depositing composition, along with one or more anodes positioned in face-to-face relationship with the cathode. The design allows for the application of voltage between the anode and cathode, producing a current that creates a current density gradient on the cathode. This gradient consists of high and low current density areas, with the anode configured to concentrate opposite the high current density areas of the cathode. This innovative approach effectively controls the thickness of deposition by regulating the current flowing to the cathode.

Career Highlights

Wayne T. Smith is associated with Shipley Company, L.L.C., where he continues to apply his knowledge and skills in the field of electrophoretic deposition. His work has contributed to advancements in the technology used for insulating coatings.

Collaborations

Some of Wayne T. Smith's coworkers include Stephen S. Rodriguez and Martin J. Harris, who have likely collaborated with him on various projects within the company.

Conclusion

Wayne T. Smith's contributions to the field of electrophoretic deposition through his innovative patent demonstrate his commitment to advancing technology in this area. His work continues to influence the industry and showcases the importance of innovation in engineering.