Company Filing History:
Years Active: 2002-2004
Title: Wayne Lougher: Innovator in Chemical Mechanical Planarization Technology
Introduction
Wayne Lougher is a notable inventor based in Phoenix, AZ (US), recognized for his contributions to the field of chemical mechanical planarization (CMP) technology. With a total of 3 patents to his name, Lougher has made significant advancements that enhance the efficiency and effectiveness of wafer polishing processes.
Latest Patents
One of Lougher's latest patents is the Laminated Wear Ring, designed for CMP apparatuses. This innovative wear ring improves the control of material removal from the edge of a wafer during polishing operations. It features a high stiffness stainless steel base that prevents flexing during polishing, ensuring better control of the polishing pad against the wafer surface. Additionally, the plastic laminate protects the stainless steel base from the polishing slurry and minimizes the risk of mechanical damage to the wafer.
Another significant patent is the Workpiece Carrier Retaining Element. This invention includes a wafer carrier retaining ring with a first annular surface that contacts the polishing surface during the polishing process. The design incorporates specific radius dimensions to prevent damage to the wafer being polished. In some embodiments, the retaining ring is made from ceramic material, enhancing its durability and performance.
Career Highlights
Wayne Lougher is currently employed at Speedfam-IPEC Corporation, where he continues to innovate in the CMP technology sector. His work has been instrumental in developing solutions that address the challenges faced in wafer polishing.
Collaborations
Lougher has collaborated with notable colleagues, including Timothy S. Dyer and David T. Marquardt, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Wayne Lougher stands out as a key figure in the field of chemical mechanical planarization, with his patents reflecting a commitment to advancing technology in wafer processing. His contributions continue to influence the industry positively.
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