Wayne L Bonde

Title: Wayne L Bonde: Innovator in Thermal Management and Component Protection

Introduction

Wayne L Bonde is a notable inventor based in Pleasanton, CA (US). He has made significant contributions to the fields of thermal management and component protection, holding a total of 2 patents. His innovative approaches have paved the way for advancements in various electronic applications.

Latest Patents

Wayne L Bonde's latest patents include a "Process for protecting bonded components from plating shorts" and a "Microchannel heat sink assembly." The first patent describes a method that protects the region between a component and its substrate using an electrically insulating fillet of photoresist. This innovative approach prevents shorting of plated conductors during subsequent metal plating. The second patent presents a microchannel heat sink designed to operate across a wide thermal range, from cryogenic temperatures to several hundred degrees centigrade. This heat sink is versatile, accommodating various fluids and high-pressure operations, making it suitable for applications in supercomputers and integrated circuits.

Career Highlights

Throughout his career, Wayne has worked with esteemed organizations, including the United States of America as represented by the United States and the University of California. His work has significantly impacted the development of technologies that require efficient thermal management and component reliability.

Collaborations

Wayne has collaborated with notable professionals in his field, including Robert J Contolini and Lisa A Tarte. These collaborations have contributed to the successful development and implementation of his innovative patents.

Conclusion

Wayne L Bonde's contributions to innovation in thermal management and component protection highlight his role as a significant inventor. His patents reflect a commitment to advancing technology in critical applications.