Lakeville, MN, United States of America

Wayne Kuechenmeister

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Hni Technologies Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wayne Kuechenmeister. Retrieved from https://idiyas.com/inventor/wayne-kuechenmeister

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Wayne Kuechenmeister and His Fireplace Installation Patent.

Introduction

Wayne Kuechenmeister is an inventor associated with Lakeville, Minnesota, and HNI Technologies Inc. His patent work includes a fireplace system designed to make brick-panel installation more secure and organized.

Latest Patents

Kuechenmeister is credited with 1 patent: “Brick Installation Kit, and Associated Methods of Assembly and Fireplace Systems.” The invention describes a kit with retention brackets, clips, and brick panels. Slots in the brackets receive the clips, while grooves along the edges of each panel engage the clips’ feet and heads. This arrangement is intended to hold the panels in place as part of a fireplace system.

Career Highlights

The available information identifies Kuechenmeister’s work with HNI Technologies Inc. and documents his contribution to fireplace installation technology. His patent focuses on the practical assembly and retention of brick panels.

Collaborations

Richard D. Berg and Gary L. Butler are identified as Kuechenmeister’s coworkers. The available details do not specify whether they collaborated with him on this patent.

Conclusion

Wayne Kuechenmeister’s documented invention addresses the assembly of brick panels in fireplace systems through a coordinated design of brackets, clips, and grooves.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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