Company Filing History:
Years Active: 2015-2018
Title: Wayde Jaskela: Innovator in Modular Technology
Introduction
Wayde Jaskela is a notable inventor based in Windsor, CA (US). He has made significant contributions to the field of modular technology, holding a total of 3 patents. His work focuses on enhancing the functionality and efficiency of computer hardware systems.
Latest Patents
One of Wayde's latest patents is the "Variable width PCIe interface." This invention features a chassis that includes a midplane defining multiple expansion sockets on one side and one or more motherboard sockets on the other. A modular motherboard can be removably inserted into the chassis, allowing for simultaneous engagement with an expansion card across multiple sockets. The motherboard intelligently allocates lanes to the expansion card based on the number of occupied sockets.
Another significant patent is the "Modular fan and motherboard assembly." This design includes a chassis that defines a slot for receiving a motherboard. The motherboard can be inserted into the slot and features several fan module receivers along its edge. Fan modules can be inserted and removed while the motherboard is still in the chassis, ensuring ease of maintenance and flexibility in design.
Career Highlights
Wayde Jaskela is currently employed at Ciena Corporation, where he continues to innovate in the field of technology. His work has been instrumental in developing modular systems that enhance the performance and adaptability of computing hardware.
Collaborations
Wayde collaborates with talented individuals such as Raleigh Bettiga and Colin Wilson, contributing to a dynamic team environment that fosters innovation and creativity.
Conclusion
Wayde Jaskela's contributions to modular technology through his patents and work at Ciena Corporation highlight his role as a significant inventor in the tech industry. His innovative designs continue to shape the future of computer hardware systems.