Tokyo, Japan

Wataru Kikuta

This inventor holds 1 USPTO granted patent. Top assignee: Ricoh Company, Ltd.. Active years: 2018.


% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Wataru Kikuta: Innovator in Polishing Technology

Introduction

Wataru Kikuta is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of polishing technology. His innovative approach has led to the development of a unique polishing sheet that enhances the efficiency of polishing processes.

Latest Patents

Wataru Kikuta holds a patent for a polishing sheet, polishing tool, and polishing method. This patent includes a sheet featuring one side with a surface and a plurality of convex portions that project from the surface. Each convex portion is equipped with first abrasive grains on its upper surface, while the sheet's surface contains second abrasive grains. Notably, the second abrasive grains possess a hardness that is higher than that of the first abrasive grains. This design allows for improved polishing performance and versatility.

Career Highlights

Wataru Kikuta is currently employed at Ricoh Company, Ltd., where he continues to innovate and develop new technologies. His work at Ricoh has positioned him as a key player in the advancement of polishing tools and methods. His dedication to research and development has resulted in practical solutions that benefit various industries.

Collaborations

Wataru has collaborated with talented coworkers such as Kiyotaka Sawada and Jun Zhang. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Wataru Kikuta's contributions to polishing technology exemplify the impact of innovative thinking in engineering. His patent for a polishing sheet showcases his commitment to enhancing industrial processes. Through his work at Ricoh Company, Ltd., he continues to push the boundaries of what is possible in polishing technology.

Profile summary based on public USPTO records.
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