This inventor holds 1 USPTO granted patent. Top assignee: Raytheon Company. Active years: 1999.
Company Filing History:
Years Active: 1999
Title: Warren W. Hayden: Innovator in Electronic Micropackaging
Introduction
Warren W. Hayden is a notable inventor based in Torrance, California. He has made significant contributions to the field of electronic micropackaging, showcasing his innovative spirit through his patented inventions. His work primarily focuses on enhancing the efficiency and functionality of microelectronic module assemblies.
Latest Patents
Warren W. Hayden holds a patent for an "Electronic micropackaging assembly and its fabrication." This invention involves a multilayer microelectronic module assembly that consists of at least two planar module structures. These structures lie parallel to each other and are electrically interconnected. Each module structure features electronic circuitry and electrical interconnect locations that align with those on adjacent structures. The invention utilizes closely spaced direct electrical interconnectors to facilitate these connections, allowing for a more efficient design. This method provides room for attaching a thermally conductive heat sink, which effectively dissipates heat generated by the electronic circuitry.
Career Highlights
Warren W. Hayden is associated with Raytheon Company, where he has contributed to various projects and innovations in the field of electronics. His expertise in micropackaging has positioned him as a valuable asset within the company.
Collaborations
Warren has collaborated with Ronald L. Williams, working together to advance their projects and share insights in their field of expertise.
Conclusion
Warren W. Hayden's contributions to electronic micropackaging demonstrate his innovative approach to solving complex engineering challenges. His patent reflects a commitment to improving the efficiency of microelectronic systems, making a lasting impact in the industry.