Lakeland, FL, United States of America

Warren E Sevrence

This inventor holds 1 USPTO granted patent. Top assignee: Acco Babcock Inc.. Active years: 1987.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Warren E Sevrence. Retrieved from https://idiyas.com/inventor/warren-e-sevrence-rtf4iiut

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 1987

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1 patent (USPTO):Explore Patents

Title: Warren E. Sevrence: Innovator in Flexible Conduit Technology

Introduction

Warren E. Sevrence is a notable inventor based in Lakeland, FL (US). He has made significant contributions to the field of flexible conduit technology. His innovative designs have paved the way for advancements in cable management solutions.

Latest Patents

Warren E. Sevrence holds a patent for a flexible conduit. This conduit features an anti-friction liner that is designed to surround a movable core. The liner is encased by a series of spiraled lay wires, which are further protected by a spiral wound overlap wrap. This wrap is made from a plastic material that provides a sealing mechanism for the conduit. It also possesses high tension properties to prevent the wires from moving radially during any bending of the conduit. He has 1 patent to his name.

Career Highlights

Warren E. Sevrence is associated with Acco Babcock Inc., where he applies his expertise in developing innovative solutions for flexible conduits. His work has been instrumental in enhancing the performance and reliability of cable management systems.

Collaborations

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Conclusion

Warren E. Sevrence's contributions to flexible conduit technology demonstrate his commitment to innovation and excellence in engineering. His patent reflects a significant advancement in the field, showcasing his ability to solve complex problems through inventive design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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