Guangdong, China

Wang Xiong

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Zte Corporation. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wang Xiong. Retrieved from https://idiyas.com/inventor/wang-xiong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Wang Xiong - Innovator in PCB Processing Technology

Introduction

Wang Xiong is a notable inventor based in Guangdong, China. He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative approach has led to advancements that enhance the efficiency and effectiveness of PCB processing methods.

Latest Patents

Wang Xiong holds a patent for a PCB processing method and a PCB. The patent outlines a method that involves laminating multiple PCB daughter boards, drilling, and electroplating to create via holes. This method allows for the formation of a PCB by laminating the daughter boards together and drilling to create through holes for connector mounting. The design improves the spacing between wafers, effectively doubling the layout space, which is crucial for modern electronic applications.

Career Highlights

Wang Xiong is currently employed at ZTE Corporation, a leading telecommunications and technology company. His work at ZTE has allowed him to apply his innovative ideas in a practical setting, contributing to the company's advancements in technology.

Collaborations

Wang has collaborated with talented coworkers such as Fengchao Ma and Bi Yi. Their combined expertise has fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Wang Xiong's contributions to PCB processing technology exemplify the impact of innovation in the electronics industry. His patent reflects a commitment to improving manufacturing processes and enhancing product performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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