San Jose, CA, United States of America

Wanfen Teng

This inventor holds 1 USPTO granted patent. Top assignee: Super Micro Computer, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wanfen Teng. Retrieved from https://idiyas.com/inventor/wanfen-teng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Wanfen Teng: Signal Optimization and Heat-Source-Aware Systems

Introduction

Wanfen Teng is an inventor based in San Jose, California, and is associated with Super Micro Computer, Inc. His patent work addresses signal optimization in systems that account for information from different heat sources.

Latest Patents

Teng is named on one patent: System and Method for Signal Optimization Adjustment Based on Different Heat Source Information. The patent describes a system with heat-source measurers, two system chips, an electrical interconnection, and a bit-error-risk evaluator. One chip transmits a signal, while the other receives it and provides information about the receiver’s electrical characteristics. Using that information, the evaluator adjusts the electrical characteristics of the signal receiver to optimize signal performance. The disclosure also presents a method for carrying out this adjustment. Teng’s listed portfolio includes 1 patent.

Career Highlights

Teng’s documented patent contribution focuses on signal optimization informed by heat-source information. His association with Super Micro Computer, Inc. connects this work to a company active in computer and server technology.

Collaborations

Teng’s listed coworkers include Yi-Min Yu and Jason Yeh. Their names are provided as professional collaborators, though specific roles in the patent are not stated here.

Conclusion

Wanfen Teng’s patent describes an approach to optimizing signal characteristics by using receiver-state information and accounting for different heat sources.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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