Taipei, Taiwan

Wan-Chin Hsiao

This inventor holds 1 USPTO granted patent. Top assignee: Asustek Computer Inc.. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wan-Chin Hsiao. Retrieved from https://idiyas.com/inventor/wan-chin-hsiao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Wan-Chin Hsiao: Innovator in Heat Dissipation Technology

Introduction

Wan-Chin Hsiao is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic device cooling solutions. His innovative approach to heat dissipation has led to the development of a patented technology that enhances the performance and longevity of electronic devices.

Latest Patents

Wan-Chin Hsiao holds a patent for a heat dissipating apparatus designed for electronic devices with integrated heat spreaders. This apparatus features a base connected to the heat spreader, which includes a concave area and at least one fin. The design ensures efficient heat transfer, thereby improving the overall functionality of the electronic device.

Career Highlights

Hsiao is currently employed at Asustek Computer Inc., a leading company in the technology sector. His work focuses on developing advanced cooling solutions that are essential for modern electronic devices. His expertise in this area has positioned him as a key player in the industry.

Collaborations

Wan-Chin Hsiao has collaborated with Chao-Tsai Chung, further enhancing the innovative capabilities within his team. Their combined efforts have led to advancements in heat dissipation technologies, benefiting the products developed by Asustek Computer Inc.

Conclusion

Wan-Chin Hsiao's contributions to heat dissipation technology exemplify the importance of innovation in the electronics industry. His patented solutions not only improve device performance but also pave the way for future advancements in thermal management.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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