Brookfield, WI, United States of America

Wallis I Hoyle

This inventor holds 1 USPTO granted patent. Top assignee: Schoeneck Containers, Inc.. Active years: 1982.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wallis I Hoyle. Retrieved from https://idiyas.com/inventor/wallis-i-hoyle-s6l2v9gb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 1982

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1 patent (USPTO):Explore Patents

Title: Wallis I Hoyle: Innovator in Container Design

Introduction

Wallis I Hoyle is a notable inventor based in Brookfield, WI (US). He has made significant contributions to the field of container design, particularly through his innovative patent for a bottle. His work has been instrumental in enhancing the functionality and efficiency of packaging solutions.

Latest Patents

Wallis I Hoyle holds a patent for a bottle, showcasing his creativity and technical expertise in the design of containers. This patent reflects his commitment to improving everyday products and making them more user-friendly.

Career Highlights

Hoyle is associated with Schoeneck Containers, Inc., a company known for its dedication to quality and innovation in packaging solutions. His role at the company has allowed him to apply his inventive skills in a practical setting, contributing to the development of new products.

Collaborations

Throughout his career, Wallis I Hoyle has collaborated with talented individuals such as Robert L Schoeneck and William C Smith. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Wallis I Hoyle is a distinguished inventor whose work in container design has made a lasting impact. His patent for a bottle and his collaborations with colleagues highlight his dedication to innovation in the packaging industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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